【Applications】
・Surface grinding of silicon wafer
・Backgrindinge

【Features & Benefits】
■BH7
Due to superior self-sharpening, this wheel offers free-cutting for hard-to-grind etched surface (after etching) of silicon wafer without dressing.
Due to advanced bond system and wheel design, this wheel provides long life with low power.

■BH14
By employing filler which can decrease grinding force and porous structure, this wheel offers high grinding performance with low power.
BH14 wheel offers good wafer surface quality with minute damages.

■VDR
Due to uniform distribution of micro diamond abrasives, this wheel offers less scratches.
Due to strong abrasives holding strength and high rigidity of vitrified bond wheel, mirror surface finish with high accuracy can be achieved.
And also, due to porous structure, this wheel offers free cutting.