Surface grinding of silicon wafer, Backgrinding

HSW WHEEL has a flap structure reinforced by the resin impregnation.

SPIRAL CUTTER, an elastic grinding wheel, is developed based on our know-how and advanced manufacturing technologies combined with coated and bonded abrasives.

Due to high grinding ability, this wheel is suitable for removing hole plugging ink.

In edge grinding tighter profile tolerance and finer surface roughness are required, these wheels would satisfy these needs.

P-GANGED WHEEL is abrasives for polishing SUS-made press plate. Due to high grinding ability and moderate flexibility, this wheel provides gentle cleaning action on the surface of PCB.

P-FLAP WHEEL has the moderately flexible structure, which provides gentle cleaning action on the surface of PCB.

PCW WHEEL has a wide variety of grit sizes and hardness levels to meet various applications. This wheel has a half-cut type (aluminum core) as well as a straight type.

Uniform surface finish without polishing variation and wild scratches.

VC WHEEL is a convolute wheel with grinding ability.