【Applications】
・Grinding prior to dry-film lamination.
・Deburring after drilling (before copper plating)
・Surface finishing prior to solder resist.
【Features & Benefits】
■Uniform surface finish without polishing variation and wild scratches.
■Minified buff dust size prevents holes from loading.
■Improved durability contributes to a cost reduction.
・Grinding prior to dry-film lamination.
・Deburring after drilling (before copper plating)
・Surface finishing prior to solder resist.
【Features & Benefits】
■Uniform surface finish without polishing variation and wild scratches.
■Minified buff dust size prevents holes from loading.
■Improved durability contributes to a cost reduction.
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